Solvent systems for metals and inks

C - Chemistry – Metallurgy – 09 – D

Patent

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Details

C09D 11/02 (2006.01) B41J 2/01 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2663688

Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.

La présente invention concerne des systèmessolvants et des dispersions comprenant ces systèmes solvants, à utiliser dans des compositions comprenant des métaux et des encres. Dans certains exemples, ces systèmes solvants peuvent être utilisés avec des particules métalliques coiffées pour fournir une dispersion qui peut être utilisée pour imprimer les lignes conductrices.

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