Molding system having thermal-management system, amongst...

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 45/72 (2006.01) B29C 45/76 (2006.01)

Patent

CA 2657357

The present invention discloses a thermal management system for a molding system. The thermal management system includes a thermolator mounted onto a movable platen, and a heat exchange reservoir. The heater exchange reservoir is configured to pump heat into a movable-mold portion to a predetermined temperature, and the thermolator is configured to maintain thermal condition of the movable-mold portion in an operational temperature during the molding operation period once the heat exchange reservoir is disconnected from the thermolator.

L'invention concerne un système de gestion thermique pour système de moulage. Le système de gestion thermique comprend un thermorégulateur monté sur un plateau mobile, et un réservoir d'échange de chaleur. Le réservoir d'échange de chaleur est conçu pour pomper de la chaleur dans une partie d'un moule mobile à une température donnée, et le thermorégulateur est conçu pour maintenir les conditions thermiques de la partie du moule mobile à une température de fonctionnement pendant la période de l'opération de moulage, après que le réservoir d'échange de chaleur a été déconnecté du thermorégulateur.

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