Phenol formaldehyde adhesive composition for wafers of wood...

Details Phenol formaldehyde adhesive composition for wafers of wood... Phenol formaldehyde adhesive composition for wafers of wood...

C - Chemistry, Metallurgy

09

J

400/4204, 400/54

C09J 161/06 (2006.01) C09J 161/12 (2006.01)

Patent

CA 2013235

ABSTRACT An adhesive composition is provided for bonding wafers of wood having a moisture content greater than 8%. The adhesive is in powder form suitable for wafer board and avoids the necessity of drying wood wafers to a low moisture content. The adhesive composition comprises a combination of A, a resin powder consisting of a phenol formaldehyde condensation product in acid form with thermal softening of at least about 10% when heated above 150°C; B a component selected from the group consisting of cyclic carbonates, low molecular weight phenol formaldehyde resins, phenol formaldehyde resorcinol resins and mixtures thereof; C, a resin powder consisting of a phenol formaldehyde condensation product in the alkaline salt form with thermal softening of at least about 60% when heated above 150°C; the composition of components A, B and C having a thermal softening of at least about 30% when heated above 150°C.

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