Aqueous acid bath for the galvanic deposition of shiny...

Details Aqueous acid bath for the galvanic deposition of shiny... Aqueous acid bath for the galvanic deposition of shiny...

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01) C25D 5/02 (2006.01) C25D 7/12 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2001185

The present invention permits an aqueous acid both for the galvanic deposition of shiny copper coatings free from cracks particularly for reinforcing the conduction pads of printed circuits having excellent breaking elongation. The bath contains at least one copper salt, at least one inorganic acid and, when required, a chloride and a compound containing an amide group, an organic thio compound containing water-soluble groups, and, when required, an oxygen-containing high-molecular organic compound, said bath containing a content at least one compound containing at least one lactam alkoxylate as amide group, said lactam alkoxylate being substituted when required.

L'invention permet d'obtenir un acide aqueux pour le dépôt galvanique de revêtements brillants de cuivre, exempts de fissures, notamment pour renforcer les réseaux conducteurs de circuits imprimés, avec d'excellentes propriétés d'allongement à la rupture. Le bain renferme au moins un sel de cuivre, au moins un acide minéral et, selon les besoins, un chlorure et un composé renfermant un groupe amide, un composé organique thio contenant des groupes hydrosolubles et, selon les besoins, un composé organique oxygéné de masse moléculaire élevée; le bain renferme également au moins un composé avec un alcoxylate de lactame comme groupe amide; l'alcoxylate de lactame est avec ou sans substitution, selon les besoins.

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