H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/473 (2006.01) H01L 23/04 (2006.01) H01L 23/043 (2006.01) H01L 23/06 (2006.01) H01L 23/31 (2006.01)
Patent
CA 2160495
Improved heat dissipation is achieved by a microelectronic device comprising: a package body having at least one interior duct formed therein through which a cooling fluid may pass; one or more integrated circuit dies disposed within the package body in a manner allowing the one more integrated circuit dies to be exposed to the cooling fluid; and connectors for connecting the one or more integrated circuit dies to an electrical circuit external to the microelectronic device. In an illustrative example of the invention, the interior duct is coupled to an external cooling fluid supply and return via openings on the sides of the package body, to advantageously provide the package with the same profile as a conventional package. In another illustrative example of the invention, the duct is separated from the integrated circuit die by a thin partition disposed in the package body. The thin partition is adapted to prevent direct contact between the cooling fluid and circuit die while offering minimal thermal resistance thereby allowing a high degree of heat transfer to the cooling fluid.
At&t Corp.
Kirby Eades Gale Baker
LandOfFree
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