Electroless nickel plating

Details Electroless nickel plating Electroless nickel plating

C - Chemistry, Metallurgy

23

C

6/5

C23C 18/36 (2006.01) C23C 18/34 (2006.01)

Patent

CA 1079454

ABSTRACT OF THE DISCLOSURE This invention is for a stabilized electroless plating solution for nickel and its alloys which solution contains an iodo substituted organic compound soluble in solution to the extent of at least one part per million parts of solution.

264193

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