Photoresist formulations containing a n-substituted...

Details Photoresist formulations containing a n-substituted... Photoresist formulations containing a n-substituted...

H - Electricity

05

K

96/155, 96/190,

H05K 3/18 (2006.01) G03F 7/085 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1136472

Abstract of the Disclosure Photoresist compositions with improved adhesion proper- ties are provided for use in making printed circuit boards, lithographic plates, relief image plates or cylinders and for other applications in the graphic arts. The subject invention also provides for methods and photoresist elements utilizing the photoresist compositions. The photoresist compositions include, in addition to the photopolymerizable compound, a photoinitiator, a polymeric binder, and other optional addi- tives and N-substituted benzotriazoles which serve as improved adhesion promoters.

363983

Affiliated with

Also associated with

Rating

Photoresist formulations containing a n-substituted... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist formulations containing a n-substituted..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist formulations containing a n-substituted... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-210574