Interconnected module

Details Interconnected module Interconnected module

H - Electricity

05

K

347/35

H05K 7/06 (2006.01) H01R 12/16 (2006.01) H05K 1/14 (2006.01)

Patent

CA 1042541

ABSTRACT OF THE DISCLOSURE Solderable conductive strips bonded to ceramic insulator spacers interconnect terminals of adjacent sub- strates in a microcircuit module. Input-output connector pins are bonded to a selected base substrate and are electrically connected to the conductive strips which serve as through connecting means. Assembly and disassembly are accomplished by a reflow soldering procedure wherein hot gas is applied to the spacer-substrate interface, thereby minimizing the risk of substrate heat damage. The resulting electrical and mechanical connection is more reliable than the connection established by conventional structures having interconnecting pins since pin alignment stresses are eliminated.

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