C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
6/6
C08L 83/04 (2006.01) C08G 77/26 (2006.01)
Patent
CA 995406
LandOfFree
Mold release composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mold release composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold release composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-240566