H - Electricity – 01 – L
Patent
H - Electricity
01
L
347/4
H01L 23/44 (2006.01) H01L 23/367 (2006.01) H01L 23/40 (2006.01) H01L 23/473 (2006.01) H01L 25/11 (2006.01) H05K 7/20 (2006.01)
Patent
CA 1138562
6414 INVENTORS: PETER KNAPP and XAVER VOGEL CAN INVENTION: COOLING APPARATUS FOR SEMICONDUCTOR ELEMENTS ABSTRACT OF THE DISCLOSURE A cooling apparatus for high-power semiconductors with fluid cooling, especially for track-bound vehicles or railroads and for generator excitation. The disk-shaped semi- conductor elements to be cooled are in pressure contact with metallic cooling elements and are arranged, in conjunction therewith, in flow channels. The flow of the cooling agent predominantly is conducted through such cooling elements. Within the cooling elements there are arranged, perpendicular to their contact surface with the semiconductor elements, heat conducting elements in a plug or plate configuration. These heat conducting or dissipation elements produce a turbulent fluid flow. The cooling element base or floor can have a non- uniform or irregular wall thickness. Two substantially identical cooling elements can be in heat conducting contact with one an- other by means of their heat conducting elements, and a flow conducting plate, arranged between such cooling elements, simultaneously can be employed as electrical contact.
331260
Knapp Peter
Vogel Xaver
Bbc Brown Boveri & Company Limited
Johnson & Hicks
LandOfFree
Cooling apparatus for semiconductor elements does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling apparatus for semiconductor elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus for semiconductor elements will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-453654