C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
154/122, 154/135
C08J 5/22 (2006.01) B32B 17/04 (2006.01) B32B 27/00 (2006.01) B32B 27/06 (2006.01)
Patent
CA 982467
E.i. Du Pont de Nemours And Company
LandOfFree
Substrate encapsulated in a fluorinated polymer containing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate encapsulated in a fluorinated polymer containing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate encapsulated in a fluorinated polymer containing... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-463359