Substrate encapsulated in a fluorinated polymer containing...

C - Chemistry – Metallurgy – 08 – J

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154/122, 154/135

C08J 5/22 (2006.01) B32B 17/04 (2006.01) B32B 27/00 (2006.01) B32B 27/06 (2006.01)

Patent

CA 982467

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