Structured copper strain buffer

Details Structured copper strain buffer Structured copper strain buffer

H - Electricity

01

L

356/21

H01L 23/48 (2006.01)

Patent

CA 1139013

ABSTRACT OF THE DISCLOSURE A structured copper strain buffer, which is thermally and electrically conductive is provided for use with semiconductor electronic devices. A thermo- compression diffusion bond is used to attach a metallic foil two a structured copper disk to form the strain buffer. The individual strands of copper within the strain buffer are capable of independent movement. The structured copper strain buffer provides a means of attachment to a semiconductor device without causing a stress to be generated at the attached surface of the device as the device expands and contacts with temperature changes.

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