Epoxy adhesive sealant

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/5805

C08L 63/00 (2006.01) C08G 59/18 (2006.01) C09D 5/34 (2006.01)

Patent

CA 1112783

Abstract of the Disclosure: An epoxy adhesive sealant composition comprised of an uncured epoxy resin composition and a composition capable of curing the epoxy resin composition, one of said compositions containing a coloring agent effective to impart latently transient color to said composition unlike the color of the non-colored composition. Substantially equal amounts of each of said compositions are combined to form a substantially uniformly colored composition which becomes essentially color- less with curing of the epoxy resin composition.

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