Epoxy imide compositions

Details Epoxy imide compositions Epoxy imide compositions

C - Chemistry, Metallurgy

08

L

117/183, 400/400

C08L 63/00 (2006.01)

Patent

CA 1162684

ABSTRACT OF THE DISCLOSURE A composition useful for making circuit boards which is the reaction product of (a) an epoxy resin or an epoxy novolac resin and optionally, a brominated epoxy resin and (b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formula H2N-Rl-NH2 where Rl is an aromatic, aliphatic or cycloaliphatic group; The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used to form a circuit boards that have good electrical and physical properties.

373170

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