Silicone epoxy curable compositions

Details Silicone epoxy curable compositions Silicone epoxy curable compositions

C - Chemistry, Metallurgy

08

K

402/8

C08K 3/18 (2006.01) C08K 5/04 (2006.01) C08L 63/00 (2006.01) C08L 83/00 (2006.01)

Patent

CA 1051586

Abstract of Disclosure The admixing of a small amount of an organosilicon compound containing at least one silicon- bonded hydrogen atom per molecule with curable compositions comprising a hydroxyl-containing organosilicon compound, an epoxy compound and certain catalytic aluminum compounds to improve the performance of the cured composition is disclosed. The improved compositions are especially useful as a resin binder in molding compounds that are used to mold electronic devices.

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