Polyester resin compositions containing dicyclopentadiene...

C - Chemistry – Metallurgy – 08 – L

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C08L 67/06 (2006.01) B32B 27/00 (2006.01)

Patent

CA 1081390

ABSTRACT OF THE DISCLOSURE This invention is directed to a thermosetting resin composition comprising from 80 to 30 percent by weight of an unsaturated polyester resin containing from 10 to 100 mole percent of a dicyclopentadiene concentrate based upon the moles of dicarboxylic acid or anhydride contained in said polyester resin and from 20 to 70 percent by weight of an ethylenically unsaturated monomer. The invention is characterized in that the ethylenically unsaturated monomer comprises from 5 to 90 percent by weight of a dicyclopentadiene alkenoate and from 95 to 10 percent by weight of a vinyl aromatic monomer. The thermo- setting resin composition is useful in preparing laminates, molded articles and coatings.

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