C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3040
C08L 53/02 (2006.01) C08L 71/12 (2006.01)
Patent
CA 1156783
8CN-2542 ABSTRACT OF THE DISCLOSURE Thermoplastic molding compositions containing poly- phenylene ether as the principal structural polymer provide moldings of superior processability and high impact resistance when they contain a minor amount of a selectively hydrogenated radial teleblock copolymer comprising vinyl aromatic compound blocks and saturated rubber blocks.
365277
Lee Gim F.
Company General Electric
Eckersley Raymond A.
LandOfFree
Molding compositions comprising polyphenylene ether and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molding compositions comprising polyphenylene ether and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding compositions comprising polyphenylene ether and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-74531