C - Chemistry – Metallurgy – 22 – F
Patent
C - Chemistry, Metallurgy
22
F
148/35
C22F 1/08 (2006.01)
Patent
CA 1045009
ABSTRACT OF THE DISCLOSURE A processing method for certain copper base alloys is described which reduces or eliminates the tendency for blister formation during annealing of alloy strip. The problem involves the formation of internal voids and subsequent migration and expansion of hydrogen within these voids, and the solution to the problem includes annealing under carefully controlled conditions of temperature and metal thickness so as to reduce the hydrogen level followed by a controlled deformation which heals the internal defects.
232192
Cheskis Harvey P.
Pryor Michael J.
Shapiro Stanley
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