Integrated circuit device and sub-assembly

Details Integrated circuit device and sub-assembly Integrated circuit device and sub-assembly

H - Electricity

05

K

356/122

H05K 3/10 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1156771

ABSTRACT OF THE DISCLOSURE The present invention relates to an integrated circuit device particularly of the type carrying multiple memory circuits or the like. The device incorporates a lead frame of the sort which includes an elongate metallic web and is characterized by the lead frame providing an integral seat or platform whereon is mounted a capacitor device which is connected or adapted to be connected in shunting relation of the power supply inputs to the integrated circuit device, whereby the capacitor provides a convenient mounting platform for the circuit bearing elements and also assures minimal lead lengths between the capacitor and the power supply inputs of the circuit bearing chip. Due to the shortness of such lead lengths and consequent reduction of the inductance reactance of the power supply circuit, efficient dampening of switching transients is achieved with the use of capacitors of much smaller values, in less area than heretofore required in external dampening applications.

383371

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