Thin conductor lines made by a mask lift-off technique

Details Thin conductor lines made by a mask lift-off technique Thin conductor lines made by a mask lift-off technique

H - Electricity

05

K

148/1, 356/134,

H05K 3/00 (2006.01) H01L 21/00 (2006.01) H01L 23/485 (2006.01) H01L 29/423 (2006.01) H01L 29/768 (2006.01)

Patent

CA 1043471

ABSTRACT: A method of providing on a substrate surface a conductor pattern having portions which are present at a mutual distance smaller than 10 µ by directed deposition of the material for the conductor portions according to different directions via a mask which has apertures which are present comparatively closely beside each other and which mask is arranged at a small distance above the substrate surface. Said method is suitable in particular for use in the manufact- ure of semiconductor devices, for example, charge transfer devices. -21-

237766

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