Integrated circuit package

Details Integrated circuit package Integrated circuit package

H - Electricity

05

K

356/11

H05K 5/06 (2006.01) H01L 21/52 (2006.01) H01L 23/04 (2006.01) H01L 23/057 (2006.01) H01L 23/24 (2006.01) H01L 23/495 (2006.01) H05K 7/02 (2006.01)

Patent

CA 1069220

ABSTRACT An integrated circuit package comprises an electrically insulating material frame defining a cavity; an integrated circuit chip received in the cavity; conductive leads extend- ing from the chip through the frame for connection to external circuitry; a sealing material gel surrounding the chip in the cavity; and a closure member sealing the cavity, the closure member being fractionally engaged with the frame.

281572

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