4. H - Electricity
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Grantley Oliver Este

H - Electricity – 01 – L

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Country: Canada

Method of cleaving a semiconductor wafer

H - Electricity – 01 – L
Patent

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Method of patterning semiconductor materials and other...

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Saw device with continous finger pattern

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Surface acoustic wave devices

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Surface acoustic wave devices

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Profile ID: LFCA-PAI-P-1094865

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