4. H - Electricity
  5. 01
  6. L

Jayesh Shah

H - Electricity – 01 – L

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Inventor

Country: United States Of America

Package or pre-applied foamable underfill for lead-free process

H - Electricity – 01 – L
Patent

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Resin encapsulated particles

C - Chemistry – Metallurgy – 08 – J
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Profile ID: LFCA-PAI-P-1617672

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