Package or pre-applied foamable underfill for lead-free process

Details Package or pre-applied foamable underfill for lead-free process Package or pre-applied foamable underfill for lead-free process

H - Electricity

01

L

H01L 23/16 (2006.01) H01L 25/00 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2535757

A B-stageable or pre-formed film underfill encapsulant composition that is used in the application of lead-free electronic components to substrates. The composition comprises an expandable microsphere, thermoplastic resin, thermoset resin, a latent catalyst, and a solvent. Various other additives, such as adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant may be dried or B-staged to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly.

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