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Leslie R. Fox

H - Electricity – 01 – L

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Country: United States Of America

Integral heat pipe module

H - Electricity – 01 – L
Patent

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Method and apparatus for packaging and cooling integrated...

H - Electricity – 01 – L
Patent

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Method of packaging and powering integrated circuit chips...

H - Electricity – 01 – L
Patent

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Method and apparatus for packaging and cooling integrated...

H - Electricity – 01 – L
Patent

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Method of packaging and powering integrated circuit chips...

H - Electricity – 01 – L
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFCA-PAI-P-1188793

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