H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/146
H01L 27/02 (2006.01) H01L 23/40 (2006.01) H01L 23/498 (2006.01) H01R 13/24 (2006.01)
Patent
CA 2016850
PD89-0243 ABSTRACT OF THE DISCLOSURE An IC chip assembly, e.g. of the TAB-type, includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A heat transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. FIG 1.
Fox Leslie R.
Schmidt William L.
Wade Paul C.
Digital Equipment Corporation
Fox Leslie R.
Schmidt William L.
Smart & Biggar
Wade Paul C.
LandOfFree
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