High solid thermosetting composition suitable for coating...

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4014, 400/50

C08L 63/00 (2006.01) C08G 59/62 (2006.01) C08K 5/1515 (2006.01) C08L 33/06 (2006.01) C08L 57/04 (2006.01)

Patent

CA 1335523

The present invention is directed to a thermosetting composition which comprises (a) a copolymer of a monomer having a polymerizable unsaturated group and an acid anhydride group and a copolymerizable monomer, of which said acid anhydride group is substantially completely half-esterified, half-thioesterified and/or half-amidated, (b) a hydroxy compound having a hydroxy value of 30 to 1,000, and (c) an epoxy compound having an epoxy value of 50 to 1,000. The thermosetting composition can be formulated in one package and exhibits good adhesion properties, gloss and definition.

607513

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