Pressure-sensitive adhesive material

Details Pressure-sensitive adhesive material Pressure-sensitive adhesive material

C - Chemistry, Metallurgy

09

J

154/140, 117/30

C09J 7/02 (2006.01) B32B 7/12 (2006.01) C09J 201/10 (2006.01)

Patent

CA 1338924

The present invention is directed to a tape or sheet form pressure-sensitve adhesive material which comprises a substrate obtainable by curing a curable resin composition comprising: (A) an organic elastomeric polymer which is liquid at room temperature and has, in a molecule, at least one silicon-containing group to the silicon atom of which is bonded at least one hydroxyl group or hydrolyzable group and which is cross linkable through formation of a siloxane bond, (B) a curing catalyst and (C) optionally, a tackifier resin and a pressure-sensitive adhesive layer laminated on said substrate. The tape or sheet form pressure-sensitive adhesive material has good flexibility and increased adhesive force, e.g. adhesive strength under shear and peel strength.

596139

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