Polyimide for high-temperature adhesive

Details Polyimide for high-temperature adhesive Polyimide for high-temperature adhesive

C - Chemistry, Metallurgy

08

G

402/221

C08G 73/10 (2006.01) C09J 5/06 (2006.01)

Patent

CA 1274937

POLYIMIDE FOR HIGH-TEMPERATURE ADHESIVE ABSTRACT This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula Image (where the positions of two carbonyl radicals in a benzene ring are meta or para, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting diamine with tetracarboxylic dianhydride in organic solvents and imidizing resultant polyamic acid. The diamine in use is ether diamine and includes 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene and 1,4-bis[4-(3-amino- phenoxy)benzoyl]benzene. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'- benzophenonetetracarboxylic dianhydride.

528101

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