C - Chemistry – Metallurgy – 08 – G
Inventor
C - Chemistry, Metallurgy
08
G
Inventor
Country: Japan
Aromatic diamine and polyimide, and preparation process of same
Flexible copper-clad circuit substrates
High-temperature adhesive of polyimide
Method for preparing polyimide and composite material thereof
Polyimide
High-temperature adhesive of polyimide
Polyimide
Polyimide and high-temperature adhesive of polyimide
Polyimide and high-temperature adhesive of polyimide
Polyimide for high-temperature adhesive
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