Polyimide and high-temperature adhesive of polyimide

Details Polyimide and high-temperature adhesive of polyimide Polyimide and high-temperature adhesive of polyimide

C - Chemistry, Metallurgy

08

G

402/221

C08G 73/10 (2006.01)

Patent

CA 1274938

POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYMIDE ABSTRACT This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula Image (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting 2,6-bis(3-amino- phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'- benzophenonetetracarboxylic dianhydride.

528830

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