High-temperature adhesive of polyimide

Details High-temperature adhesive of polyimide High-temperature adhesive of polyimide

C - Chemistry, Metallurgy

09

J

402/221

C09J 179/08 (2006.01) C08G 73/10 (2006.01)

Patent

CA 1274939

HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE ABSTRACT This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) Image (I) (where R is a tetra-valent radical selected form the group consisting of aliphatic radical having not less than two carbons, cyclo aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,- hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'- biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.

530420

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