Flexible copper-clad circuit substrates

Details Flexible copper-clad circuit substrates Flexible copper-clad circuit substrates

B - Operations, Transporting

32

B

356/4, 154/126.3

B32B 15/08 (2006.01) B32B 15/20 (2006.01) B32B 27/34 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1288327

ABSTRACT OF THE DISCLOSURE This invention relates to flexible copper-clad circuit substrates in which a copper foil is directly and firmly jointed with a polyimide film. The polyimide used is obtained conven- tionally by reacting diamine components including 3,3'- diaminobenzophenone, 1,3-bis(3-aminophenoxy)-benzene, 4,4'-bis(3- aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)-phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophe- noxy)phenyl] ketone and bis[4-(3-aminophenoxy)phenyl] sulfone, with tetracarboxylic acld dianhydride including pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride and bis(3,4-dicar- boxyphenyl) either dianhydride, in organic solvent, and by ther- mally or chemically imidizing resultant polyamic acid. The poly- imide thus obtained has relatively lower melt viscosity and is flowable at high temperatures. Therefore, the copper foil and the polyimide film were assembled, pressed by heating under pres- sure and further cured to afford the flexible copper-clad circuit substrates having the polyimide film firmly jointed with the cop- per foil.

515592

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