Method for producing an electronic circuit assembly

Details Method for producing an electronic circuit assembly Method for producing an electronic circuit assembly

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 23/538 (2006.01) H01L 25/07 (2006.01) H05K 3/24 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2273589

There is disclosed herein a method for producing a wirebonded electronic circuit assembly which obviates the need for soldering aluminum-copper wirebond pads to substrate mounting pads and other copper bonding surfaces.

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