Low dielectric glass and fiber glass for electronic...

Details Low dielectric glass and fiber glass for electronic... Low dielectric glass and fiber glass for electronic...

C - Chemistry, Metallurgy

03

C

C03C 3/091 (2006.01) C03C 3/118 (2006.01) C03C 13/00 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2672222

Glass compositions are provided that are useful in electronic applications, e.g., as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass. Glass compositions comprise (in weight%); SiO2 60-68, Li2O 0-2, B2O3 7-13 Na2O 0-1, Al2O3 9-15 K2o 0-1, MgO 8-15 Fe2O3 0-1, GO 0-4 F2 0-1, TiO2 0-2, other constituents 0-5.

L'invention propose des compositions de verre qui s'utilisent pour des applications électroniques, par exemple en tant que renforcement pour des substrats de carte à circuit imprimé. Des constantes diélectriques réduites sont fournies par rapport au verre "E", et des propriétés de formation de fibre sont fournies qui sont commercialement plus pratiques que le verre "D". Les compositions de verre comportent (en % en poids) : SiO2 60 à 68, Li2O 0 à 2, B2O3 7 à 13, Na2O 0 à 1, Al2O3 9 à 15, K2o 0 à 1, MgO 8 à 15, Fe2O3 0 à 1, GO 0 à 4, F2 0 à 1, TiO2 0 à 2, autres constituants 0 à 5.

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