Miscible blends of imide containing polymers with poly(aryl...

C - Chemistry – Metallurgy – 08 – L

Patent

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400/5809

C08L 79/08 (2006.01) C08L 81/06 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2004713

ABSTRACT OF THE DISCLOSURE This application relates to miscible blends of biphe- nyl containing polytaryl sulfones) and isopropylidene based polyimides. These blends are suitable for printed wiring board substrates, flexible printed circuit boards, electrical connectors and fabricated articles requiring heat and chemical resistance. A method for extruding these articles is taught.

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