Stripping and cleaning compositions for microelectronics

Details Stripping and cleaning compositions for microelectronics Stripping and cleaning compositions for microelectronics

C - Chemistry, Metallurgy

11

D

C11D 7/32 (2006.01) C11D 7/26 (2006.01) C11D 7/50 (2006.01) C23G 1/02 (2006.01) G03F 7/42 (2006.01)

Patent

CA 2452053

Alkaline-containing cleaning compositions and method of using the cleaning compositions for cleaning microelectronic substrates, particularly FPD microelectronic substrates, which compositions are able to essentially completely clean such substrates and produce essentially no metal corrosion of the metal elements of such substrates. The alkaline-containing cleaning compositions of this invention have {a) a nucleophilic amine, (b) a moderate to weak acid having a strength expressed as a "pKa" for the dissociation constant in aqueous solution of from about 1.2 to about 8, {c) a compound selected from an aliphatic alcohol, diol, polyol or aliphatic glycol ether, and {d) an organic co-solvent preferably having a solubility parameter of from about 8 to about 15. The cleaning compositions of this invention will gave an amount of weak acid such that the equivalent mole ratio of acid groups to amine groups is greater than .75 and may range up to and beyond a ratio of 1, such as for example a ratio of 1.02 or more. The pH of the alkaline- containing cleaning compositions of this invention will be from about pH 4.5 to 9.5.

La présente invention a trait à des compositions de nettoyage alcalines et un procédé d'utilisation des compositions de nettoyage pour le nettoyage de substrats microélectroniques, particulièrement les substrats microélectroniques FPD, lesdites compositions étant aptes au nettoyage sensiblement complète de tels substrats en ne produisant sensiblement aucune corrosion du métal des éléments métalliques de tels substrats. Les compositions de nettoyage alcalines de la présente invention comportent {a) un amine nucléophilique, (b) un acide modéré ou faible ayant une force exprimée en « pKa » pour la constante de dissociation dans la solution aqueuse variant d'environ 1,2 à 8, {c) un composé choisi parmi un alcool aliphatique, un diol, polyol ou un éther glycol aliphatique, et {d) un cosolvant organique ayant préférablement un paramètre de solubilité d'environ 8 à 15. Les compositions de nettoyage de la présente invention donnent une quantité d'acide faible, de telle sorte que le rapport molaire équivalent des groupes d'acide aux groupes d'amine est supérieur à 0,75, pouvant aller jusqu'à concurrence et au-delà d'un rapport de 1, notamment par exemple un rapport de 1,02 ou plus. Les compositions de nettoyage alcalines de la présente invention présentent un pH de 4,5 à 9,5.

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