Method and arrangement for cutting boards, especially...

Details Method and arrangement for cutting boards, especially... Method and arrangement for cutting boards, especially...

B - Operations, Transporting

28

B

B28B 11/14 (2006.01) B27B 5/00 (2006.01) B28B 11/16 (2006.01) B28D 1/04 (2006.01)

Patent

CA 2263475

The present invention relates to a method and a device for cutting board, in particular gypsum board, and for the purpose of providing a technique which will give more precise and finer cuts of standard board lengths (L1 ... Lm) in order thereby to obviate unnecessary waste cutting, there is according to the invention suggested a method and a device characterised in an initial set of cutting means (6n) which can be adjusted at intervals corresponding to an initial set of finished lengths (L1 ... Lm) for multi-cutting of such lengths, as well as an additional set of pre-adjustable cutting means (8n) which act as back-up sets or come into effect when other sets of finished lengths are to be multi-cut.

Cette invention concerne un procédé et un dispositif qui permettent de découper des plaques, notamment des plaques de plâtre. Ce procédé offre une technique qui permet d'obtenir une plus grande finesse et une plus grand précision lors de la découpe de longueurs de plaques standards (L1 ... Lm), et de limiter ainsi les chutes lors de ladite découpe. A cette fin, le dispositif et le système décrits dans la présente invention font appel à un premier ensemble de systèmes de coupe (6a). Ces systèmes de coupe peuvent être réglés à des intervalles qui correspondent à un premier ensemble de longueurs finies (L1 ... Lm), ceci de manière à effectuer une découpe multiple de ces longueurs. Ce dispositif comprend également un ensemble complémentaire de systèmes de coupe à préréglage (8n), lesquels jouent le rôle d'ensembles de support ou entrent en action lorsque l'on doit effectuer une découpe multiple pour d'autres ensembles de longueurs finies.

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