Flux-less soldering of glass to metal

Details Flux-less soldering of glass to metal Flux-less soldering of glass to metal

C - Chemistry, Metallurgy

03

C

49/81

C03C 27/04 (2006.01) H01L 21/50 (2006.01)

Patent

CA 1148360

- 10 - Case 4342 FLUX-LESS SOLDERING OF GLASS TO METAL ABSTRACT OF THE DISCLOSURE A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding of the Silicon chip prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The intermediate holder assembly includes a Borosilicated glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by an eutectic alloy solder. The soldering of the glass tube to the Nickel-Iron holder is accomplished without the use of flux due to layers of Chrome, Nickel, and Gold being formed on the glass tube.

361753

Affiliated with

Also associated with

Rating

Flux-less soldering of glass to metal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flux-less soldering of glass to metal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flux-less soldering of glass to metal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-248380