Method for sealing optical fibers to device encapsulations

C - Chemistry – Metallurgy – 03 – B

Patent

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49/82, 88/97

C03B 23/20 (2006.01) H01L 31/0203 (2006.01)

Patent

CA 1065140

Abstract of the Disclosure A low loss, high integrity seal is disclosed between an optical fiber and a device encapsulation. Critical parameters include the surface composition of the fiber and the composition and configuration of the encapsulation at the point of the seal. Specifically called for are a silica- containing fiber surface glass and a borosilicate glass encapsulation whose softening temperature is less than or equal to that of the fiber surface glass. In the preferred configuration the fiber is threaded through an orifice at the end of a tubular protrusion of the device encapsulation and the seal in made by simple heat fusion of the rim of the orifice the surface of the fiber.

252709

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