3-dimensional multi-layered modular computer architecture

Details 3-dimensional multi-layered modular computer architecture 3-dimensional multi-layered modular computer architecture

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Patent

CA 2621505

New and unique apparatuses, systems and methods are provided for constructing and implementing a 3-Dimensional multi-layered modular computer architecture that significantly improves computer mass, volume and power densities through the use of 3-Dimensional layered structure.

L'invention concerne des appareils, des systèmes et des procédés nouveaux et uniques de construction et de mise en oeuvre d'une architecture d'ordinateur modulaire tridimensionnelle à couches multiples, qui améliore sensiblement la masse, la densité et la puissance volumiques de l'ordinateur, grâce à l'utilisation d'une structure tridimensionnelle en couches.

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