C - Chemistry – Metallurgy – 25 – C
Patent
C - Chemistry, Metallurgy
25
C
C25C 7/02 (2006.01)
Patent
CA 2197161
Metal is electrolytically precipitated on a cathode plate except for a portion thereof. The non-precipitated portion enables easy peeling of the precipitated metal from the cathode plate. The ceramic coating film is formed on the non-precipitated portion and prevents intrusion of electrolytic acid between the ceramic coating film and the cathode plate. The life of the coating is prolonged. The polishing of the cathode plate can be automatized.
On précipite une partie du métal par électrolyse sur une plaque cathodique. La partie non précipitée facilite le prélèvement du métal précipité sur la plaque cathodique. La pellicule de revêtement céramique est formée sur la partie non précipitée et empêche l'intrusion d'acide électrolytique entre la couche de revêtement céramique et la plaque cathodique. La durée de vie du revêtement est prolongée. Le polissage de la plaque cathodique peut être automatisé.
Hiai Hiroshi
Ikeda Akira
Ishii Toshinori
Goudreau Gage Dubuc
Nippon Mining & Metals Co. Ltd.
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