A connection between a conductive substrate and a laminate

H - Electricity – 01 – G

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H01G 9/10 (2006.01) H01M 2/06 (2006.01)

Patent

CA 2431751

A connection (1) is provided between a conductive substrate, in the form of a planar aluminium terminal (2), and a laminate (3). The laminate has a first plastics layer, in the form of a polymer layer (4), that is secured to terminal (2) and a conductive aluminium layer (5) disposed outwardly from and adjacent to layer (4). The layers (4, 5) terminate at a common circular edge (6) that defines an opening (7) that overlies terminal (2). The connection (1) includes an insulator in the form of a grommet (8) that extends over edge (6) for electrically insulating layer (5) from terminal (2).

L'invention concerne une connexion (1) entre un substrat conducteur sous forme de borne plane en aluminium (2) et un stratifié (3). Ce stratifié possède une première couche en plastique sous forme d'une couche polymère (4) fixée à la borne (2) et une couche conductrice en aluminium (5) située à l'extérieur de la couche (4) et en position contiguë à celle-ci. Les couches (4, 5) se terminent au niveau d'un bord circulaire commun (6) définissant une ouverture (7) placée au-dessus de la borne (2). Cette connexion (1) comprend un isolant sous forme d'oeillet (8) s'étendant au-dessus du bord (6) servant à isoler électriquement la couche (5) et la borne (2).

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