C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 163/00 (2006.01) C08L 63/00 (2006.01) C09D 163/00 (2006.01) C09D 175/04 (2006.01) C09J 175/04 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2123610
Film-forming reactive systems for the surface-to-surface bonding and/or coating of substrates, more particularly for heat-sealable coatings are provided. The system is based on an aqueous dispersion of at least two epoxy-curable resins (1) and an epoxy compound as the curing component (II). The epoxy- curable resins are a polyurethane polymer containing epoxy-reactive functional groups present as the curable resin (1a) and an aqueous dispersion of an acrylate and/or methacrylate homopolymer or copolymer containing carboxyl and/or methylol groups present as an additional curable resin (1b). Also provided is a method for the production of laminates which employs the reactive system to bond substrates.
Bolte Gerd
Brueninghaus Ulrike
Henke Guenter
Henkel Kommanditgesellschaft Auf Aktien
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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