A flexible device for encapsulating electronic components

H - Electricity – 05 – K

Patent

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H05K 5/06 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2131799

ABSTRACT OF THE DISCLOSURE The present invention relates to a device for flexibly encasing electronic circuitry, where an electronic circuit is enclosed in a casing which comprises a laminate consisting of metal and plastic sheets such as to form a diffusion impervious and electrically conductive structure which prevents harmful substances from reaching the electronic circuit and also prevents inductive electromagnetic exchange. Electrical conductors pass through the joint region of the laminate.

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Profile ID: LFCA-PAI-O-2080131

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