A method and an apparatus for plasma treating the surface of...

C - Chemistry – Metallurgy – 23 – C

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C23C 4/12 (2006.01) B05B 7/22 (2006.01) C23C 4/00 (2006.01) C23C 4/02 (2006.01) C23C 8/36 (2006.01) C23C 14/02 (2006.01) C23C 14/54 (2006.01)

Patent

CA 2289873

An apparatus for plasma surface treating of substrates comprises a treatment chamber that can be evacuated as well as two adjoining pre-treatment chambers that can be evacuated as well. Both of the pre-treatment chambers are provided with a plasmatron. While a first substrate is plasma coated in the treatment chamber, a second substrate to be subsequently plasma coated is simultaneously pre-treated in a pretreatment chamber by means of the plasmatron received in that chamber. For this purpose, the second substrate is alternately heated and cleaned, whereby the second substrate, during the cleaning operation, is connected as cathode to create an electric arc between the substrate and the plasmatron. By means of such a method and such an apparatus, the throughput can be substantially increased, while the quality of the coating meets the highest requirements.

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