C - Chemistry – Metallurgy – 07 – D
Patent
C - Chemistry, Metallurgy
07
D
C07D 309/12 (2006.01) C07D 309/10 (2006.01) G03C 1/73 (2006.01) G03F 7/004 (2006.01) G03F 7/30 (2006.01)
Patent
CA 2051198
K-18250/A Acid labile solution inhibitors and positive- and negative-acting photosensitivecomposition based thereon Abstract of the Disclosure Non-polymeric compounds which contain at least one aromatic ring system carrying one or more one or more tetrahydropyranyloxy substituents of formula I Image (I), wherein Rl is hydrogen, halogen, alkyl, cycloalkyl, aryl, alkoxy or aryloxy, R2 is hydrogen, alkyl, cycloalkyl or aryl, R3 is a saturated or unsaturated hydrocarbon radical, R4 and R5 are each independently of the other hydrogen, halogen, alkyl, alkoxy or aryloxy, and X is a direct single bond or a methylene or ethylene bridge. These compounds are especially suitable for the preparation of photoresist compositions which can be used both for the production of positive as well as negative images. The photoresists are preferably used for deep-UV microlithography.
Ag Ciba-Geigy
Fetherstonhaugh & Co.
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