Adhesion promoter

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C - Chemistry, Metallurgy

09

J

117/150, 117/199

C09J 187/00 (2006.01) B05D 7/14 (2006.01) C08J 5/12 (2006.01) C09J 5/02 (2006.01) D06M 13/203 (2006.01) D06M 13/41 (2006.01) D06M 15/21 (2006.01) D06M 15/592 (2006.01)

Patent

CA 2001698

ADHESION PROMOTER Abstract of the Disclosure Described are heat-activatable adhesion promoters for treating the surfaces of metals or synthetic materi- als (plastics) prior to bonding, containing - from 0.1 to 10% by weight of a carbonyl compound having at least one activated double bond, - from 5 to 30% by weight of a polymer having functional groups, - from 0 to 10% by weight of further auxiliary materials, as well as - one or more organic solvent(s) to make 100% by weight. The invention further relates to a process for producing the heat-activatable adhesion promoter and the use thereof for the surface treatment of polymer fibers.

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