An integrated optics chip with reduced thermal errors due to...

G - Physics – 02 – B

Patent

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G02B 6/12 (2006.01)

Patent

CA 2279066

An Integrated Optics Chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating. A conductive path couples the +Z and -Z faces to prevent a charge differential from developing between the +Z and -Z faces due to a change in temperature of the optic chip and the pyroelectric effect.

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