C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
96/185, 402/190,
C08G 63/68 (2006.01) C08G 75/30 (2006.01) G03C 1/74 (2006.01) G03C 1/93 (2006.01) G03C 8/52 (2006.01)
Patent
CA 1113642
Abstract of the Disclosure Disclosed herein are heat-activatable adhesive com- positions comprising a water-soluble condensation polymer which is characterized by having a glycol component comprising one or more diols, preferably one of which is 1,4-bis(2-hydroxy- ethoxy)cyclohexane; and an acid component comprising greater than 15 and up to about 35 mole percent of at least one diacid or diester monomer having an iminodisulfonyl salt moiety, and from about 65 to about 85 mole percent of one or more other diacids or diesters. These adhesives are further characterized as having high bonding strengths at temperatures above 50°C. They have been found useful in a variety of photographic materials, and particularly in image transfer film units. -1-
286294
Hanrahan Michael J.
Mcconkey Robert C.
Noonan John M.
Eastman Kodak Company
Gowling Lafleur Henderson Llp
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